Ethiopian Missions Abroad Urged to Exert Efforts in Soliciting Technology, Financial Support

Addis Ababa ,January 15/2024(ENA)- Ethiopian missions abroad urged to make efforts on soliciting technology transfers, facilitating capacity-building programs, garnering financial support for projects, searching for destination markets and attracting Foreign Direct Investment (FDI).

The annual meeting of Ethiopian ambassadors and senior officials of the Ministry of Foreign Affairs of Ethiopia, which began last Saturday, has continued to its second day.

The annual meeting, which is part of the Diplomacy Week, takes place from January 13-27, 2024.

Today’s session deliberated on the policies, institutional frameworks, achievements and challenges of science, technology and artificial intelligence in Ethiopia, according to Foreign Affairs Ministry. 

The Minister of Science, Technology and Innovation, Belete Molla, made a presentation on the  Science , Technology and Innovation policy of Ethiopia, the achievements registered thus far and key directions set to realize digital economy.

 

The Director General of the Ethiopian Artificial Intelligence Institute, Engineer Worku Gachena, also made a presentation on the institute’s tangible role in realizing digital economy and the major results in AI in various economic sectors of the country. 

Both presenters emphasized that Ethiopian missions should work on soliciting technology transfers, facilitating capacity-building programs, garnering financial support for projects, searching for destination markets and attracting FDI.

Foreign Affairs State Minister,  Ambassador Mesganu Arga, stressed on his part the critical role of digital technology in the development of Ethiopia and the need for the increased contribution of Ethiopian missions in supporting the digital efforts.

Ethiopian Ambassadors, heads of mission and officials of the Ministry of Foreign Affairs are conducting discussion on activities being undertaken in diplomacy and field visits until the 27th of January, 2024.